Enabling the GHz Generation
3D Glass in the News
3D Glass Solutions Closes $30 Million Series C Funding Round
ALBUQUERQUE, N.M.–(BUSINESS WIRE)–3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters today announced the closing of a $30 million Series C financing. The round was led by Walden Catalyst Ventures, with participation from existing investors, including Intel Capital and Lockheed Martin Ventures, as well as new investments from Applied Ventures, LLC, Cambium Capital, and Mesh Cooperative Ventures.
3DGS Signs License for Advanced TGV formation process from Corning
Capability to address formation in semiconductor grade glasses such as HPFS and for applications including HPC (High Performing Computing, GPU/CPU packaging), MEMS, and Photonics.
3D Glass Solutions Raises Additional $4 Million in Series B1 Round Extension
Albuquerque, N.M. –(BUSINESS WIRE)–3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, announced today it has raised an additional $4 million in an extended Series B1 funding round. 3DGS welcomed new investor Menlo Microsystems Inc., as well as follow-on investments from both Corning Incorporated (NYSE: GLW) and Sun Mountain Capital, bringing the total Series B1 raise to $24 million.
3D Glass Solutions Closes $20 Million Series B1 Funding Round to Accelerate Its Revenue Growth Strategy
Albuquerque, N.M. – Nov. 30, 2021 – 3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, today announced it has secured $20 million in Series B1 funding led by Intel Capital. CerraCap Ventures, Lockheed Martin Ventures and Nagase & Co. Ltd. were also in participation. This round of funding adds Intel Capital’s David Flanagan, Lockheed Martin’s Jeff Cunningham and Nagase’s Yoriyuki Yamashiro to 3DGS’ board of directors.
3D Glass Solutions Introduces the Industry’s First Glass Ceramic-Based Technology Node for Heterogeneous Integration
ALBUQUERQUE, N.M. — June 15, 2021 — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive radio frequency (RF) devices, today introduced the industry’s first glass ceramic technology node for heterogeneous integration. The novel technology will support streamlined assembly integration and advanced packaging of commercial off the shelf components and custom integrated circuits, especially benefitting military and defense, advanced RF front end and system in package markets.
3D Glass Solutions Introduces the Industry’s First Glass Ceramic-Based Process Design Kit for Air-Filled Substrate Integrated Waveguides
ATLANTA – INTERNATIONAL MICROWAVE SYMPOSIUM — June 8, 2021 — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive radio frequency (RF) devices, today announced its newest process design kit (PDK) for Empty Substrate Integrated Waveguides (eSIW).
3D Glass Solutions Locks Process Flow for Integrative Passive Device Technology Node Process Design Kit
ATLANTA – INTERNATIONAL MICROWAVE SYMPOSIUM — June 8, 2021 — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive radio frequency (RF) devices, today announced it has locked the process flow for its integrated passive device (IPD) technology node and solidified the IPD design rules in a process design kit (PDK) available for customer release.