Interposers and Substrates

Glass-based interposers for SiP and AiP as well as photonic modules are made possible by 3DGS-enabled integration of semiconductor devices, SMT components and IPDs directly onto interposers.

RF SiP (System in Package)

Compact footprint SiPs using glass enables next-generation RF and wireless designs to facilitate wideband applications from DC to 100 GHz.

Read More


3DGS’ patented air cavity manufacturing process allows 5G millimeter-wave (mmWave) antenna and transmission-line-based structures with superior performance as compared to conventional packaging technologies, which are plagued with path losses and signal degradation. 3DGS AiP devices are scalable up to 200 GHz.

Read More