• Spectrum Control Introduces High-Q RF Filter Family

    Glass Semiconductor Packaging for Next-Generation Electronics

    3DGS manufactures glass substrates for advanced packaging that solve the thermal, electrical, and dimensional challenges holding back next-generation RF, HPC, and photonic systems. 

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  • 3DGS Texas Office ABQ Facility

    3DGS on the NSTXL Member Spotlights

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  • Glass 3D Heterogeneous Integration

    Glass 3D Heterogeneous Integration

    3D Glass Solutions (3DGS) provides glass three-dimensional heterogeneous integration (3DHI) foundry services to commercial and defense manufacturers, academia and government agencies.

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  • HPFS Glass Solutions

    3DGS Offers High performance Fused Silica (HPFS) Glass solutions

    HPFS with its extremely low loss coefficient enables Automotive Radar substrates in 70 - 150 GHz frequency range and high frequency filters in 10 - 100 GHz frequency range

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Wireless communication

Wireless Communications

3DGS enable high-performance RF subsystem implementation with significant SWaP-C benefits from sub-6 GHz through 500 GHz. Applications range from filters and high-gain antennas to complete RF front-end modules for 5G/6G infrastructure using advanced glass substrates. 

Aerospace and defense
Aerospace and Defense Solutions

Aerospace & Defense

3DGS delivers 3D heterogeneous integration (3DHI) with high-temperature capability, and RAD HARD qualification through our secure onshore foundry. Our advanced glass packaging solutions support space systems and Defense Industrial Base (DIB) programs requiring ITAR-compliant manufacturing. 

Photonics
Photonics Packaging

Photonics

Thermal stability and isolation enable lasers and Photonic Integrated Circuits (PICs) to be co-packaged on glass substrate with superior performance. 3DGS photonics platforms leverage 3DHI and glass interposer designs to deliver unique advantages for LiDAR, optical communications, and quantum photonic subsystems.

high performace computing and artificial intellegence
high performace computing

HPC/AI

Glass interposer support large panel formats, ultra-high density interconnects (HDI), and fine-pitch redistribution layers (RDL) for advanced chiplet integration — meeting the packaging demands of rapidly growing AI accelerator and data center processor markets 

Sensors
Sensors_and_actuators

Sensors

Glass core substrates for advanced packaging offer biocompatibility, optical transparency, and chemical inertness — ideally suited for bio-sensors, quantum dot sensors, MEMS devices, and medical diagnostic systems. 

Ready to Explore Glass Substrate Solutions?

Whether you're exploring glass semiconductor packaging for the first time or ready to scale from prototype to production, our U.S.-based engineering team is ready to support.

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