Precision micro-features enabled by 3DGS technology are capable of being integrated with fiber optics for fiber aligners, delivering hole-to-hole alignment of less than 1.5 µm, even in an array structure. Other photonic components include bridges and submounts.

RF Bridges

Impedance – matched custom RF bridges improve circuit-to-circuit electrical connections. The use of 3DGS glass delivers low loss performance and easy device handling.

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Diode Sub-Mounts

Laser sub mount edge wraps using precision 3DGS manufacturing techniques allow improved performance and reduced package size. Micron footprints, precision angles and integrated electrical connections are now possible.

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Fiber Aligners

3DGS technology allows precise creation of high-density fiberoptic arrays that simplify integration, alignment and assembly to reduce cost. Hole-to-hole alignment of less than 0.5 um can be achieved.

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