Babu is an accomplished semiconductor industry executive with over 38 years of experience in the field. Babu held the position of Senior Vice President and General Manager of the IP Group at Cadence Design Systems from 2017 to 2021. Babu was the co-founder and CEO of Beceem Communications, Inc., which was acquired by Broadcom in 2010. At Broadcom, he served as VP of Engineering where he led the team that developed Broadcom’s first LTE multi-mode baseband chipset. Prior to Beceem, Babu was co-founder of Centillium Communications, Inc., where he served in engineering and general manager roles of increasing responsibility, and successfully led it to an IPO, reaching a ~$3B peak market cap. Babu holds a Master of Technology degree in Electrical Engineering and Computer Science from the Indian Institute of Technology in Kanpur.
Chief technology architect and lead engineer, Jeb directs the technical team at 3DGS and interfaces with strategic partners and customers to optimize device designs for manufacture. Before founding 3DGS and while at Sandia National Laboratories, Jeb was the principal developer of the innovative micropost technology, which won a 2007 R&D 100 award. He has been the inventor or co-inventor on more than 30 patent applications and has led the development work associated with 3DGS’s novel substrates and applications. In addition to BS and MS degrees in Chemical Engineering, Jeb also holds an MBA from the University of New Mexico’s Anderson School of Management.
Adam brings over 20 years of financial leadership to the 3DGS team and is responsible for managing the Company’s financial planning, accounting, treasury, contract review, and human resources functions. His past professional roles included CFO, VP Finance, and Controller positions at EMCORE Corporation, an international high-tech public semiconductor manufacturer. Adam has a strong technical background in US GAAP accounting and extensive experience in SEC reporting, SOX compliance and internal controls, IPO and M&A transactions, and private / public debt and equity financing. Prior to EMCORE, he was a 5-yr certified public accountant with PricewaterhouseCoopers, LLP. He has a bachelor’s degree in Finance from the Pennsylvania State University and is a member of the American Institute of Certified Public Accountants.
Tim is the Director of Engineering responsible for the engineering and manufacturing of all 3DGS products. Tim brings over 25 years of technical problem-solving experience in mechanical, electrical, chemical, materials, industrial and manufacturing engineering while at Intel Corporation. During his tenure at 3DGS, he has enhanced the technical capability at all levels of the company. Results include improving yield, generating intellectual property, developing patent based process improvements, reducing cycle time and increasing purchase order closure rates. Tim has a Bachelor of Science degree in material science engineering from the University of Illinois Urbana-Champaign.
Bob has over 37 years semiconductor industry general management and business development. He was co-founder and CEO of Sarda Technologies and Symmorphix and VP at Cirrus Logic, X-Celeprint, Semprius and Nextreme Thermal Solutions. His Fortune 500 company experience includes marketing leadership at Applied Materials and Intel as well as field engineering at General Electric. Bob holds an MBA from University of Chicago and BSME from Duke University.
Dave is Sr. Managing Director Intel Capital & Vice President of Intel. Dave is a voting member & chair of Intel Capital’s investment committee. Dave joined Intel Capital in 1999. Dave oversees Intel’s next generation computing, mobile client & communication system investment areas. Dave currently oversees Intel Capital’s investments in BoomTV (esports platform) Cloudleaf Technologies (IoT Cloud), Airship (Customer Engagement Platform) and SecureKey Technologies (Next Generation Authentication Network). Dave’s recent exits include CashStar (sold to Blackhawk Network in 2017) UQ Communications (Sold to KDDI in 2014) ClearWire (Acquired by Sprint 2013). Prior to Intel Capital Dave worked in sell-side equity research for Van Kasper & Company, a San Francisco based investment banking firm where he covered technology and communications. Before that Dave worked at Transamerica, a diversified investment services company. Dave has an MBA from Georgetown University McDonough School of Business and a BA in Economics from the University of Colorado. Dave lives with his wife Kimberly and their two children in Portland Oregon.
Lip-Bu Tan is Founder and Chairman of Walden International (“WI”), a leading venture capital firm managing cumulative capital commitments of greater than $4 billion; and Founding Managing Partner of Celesta Capital and Walden Catalyst Ventures, a venture capital firm focused on investing in core technology companies. He formerly served as Chief Executive Officer of Cadence Design Systems, Inc., and now serves as Executive Chairman and has been a member of the Cadence Board of Directors since 2004. He currently serves on the Board of Schneider Electric SE (SU: FP), Intel Corporation (NASDAQ: INTC), and Credo Semiconductor (NASDAQ: CRDO). Lip-Bu focuses on semiconductor/components, cloud/edge infrastructure, data management and security, and AI/machine learning.
Jeff is an investment manager with Lockheed Martin Ventures, the venture capital investment arm of Lockheed Martin Corporation. In this capacity, he is responsible for leading the Corporation’s investments in emerging technology companies that support Lockheed Martin’s strategic business objectives. Since 2014, Jeff has led venture capital investments across a variety of technology disciplines including space technologies, artificial intelligence, cyber security, semiconductor and next generation electronics, sustainability initiatives, quantum computing, advanced energy solutions and autonomous vehicle technologies. Prior to joining Lockheed Martin Ventures, Jeff served as finance lead for a multi-billion Lockheed Martin program supporting the Department of Defense’s global data network. Jeff has served in various roles with Lockheed Martin including corporate development, program management finance, and financial planning and analysis. Jeff earned his master’s degree in Business Administration from the University of Maryland and his bachelor’s degree from Virginia Tech.
Madhavan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center (www.chimes.psu.edu). Prior to joining Penn State University, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC) at Georgia Tech. He is the author of 550+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of 3 books and 5 book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS). He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.
BOARD OF DIRECTORS