3DGS Signs License for Advanced TGV formation process from Corning
Capability to address formation in semiconductor grade glasses such as HPFS and for applications including HPC (High Performing Computing, GPU/CPU packaging), MEMS, and Photonics.
data center Si Photonics
|
APEX® Glass Photosensitive Glass Ceramic |
Pure Glass Capability Types of Glass |
|
| CTE | 9.0 | 0.0-7.0 |
| 3D Features | Via and cavities | Vias |
| Material Type | Glass-Ceramic | HPFS, Eagle XG, AF32 & other |
| Applications | RF, photonics | RF, photonics, MEMS, and high performance computing (HPC) |
| Format | Wafers | Wafers and Panels |
Key features include:
- High volume manufacturing process
- Targeting glasses with CTE matched to Silicon chips
- Produce a variety of TGV sizes, aspect ratios, and patterns (custom production ready)
- Tech Platform has ability to fully integrate RF and Digital components on single, heterogeneous solution
- See image below
