Improve and Simplify Integration
High-density arrays simplify integration, alignment, and assembly, speeding up manufacturing and reducing BOM.
ELECTRICAL AND OPTICAL INTEGRATION
Electrical traces can be combined with thru-holes to maximize integration possibilities and further reducing package sizes.
CUSTOM SOLUTIONS FOR IMPROVED OUTCOMES
Each application is unique in footprint, thermal management requirements, and additional features. Contact us directly with your specific needs.
|Size||> 1mm x 1mm||< 1mm x 1mm|
|Height||1 - 5mm||0.25 - 10mm|
|Fiber Diameters||80 - 250 microns||80 - 250 microns|
|Diameter Accuracy||+/- 1.5 microns||+/- 1.0 microns|