RF System-in-Package (SiP)

Solution Overview

Glass-based RF SiP interposers give design teams a measurable performance advantage. Our proprietary APEX® Glass substrate offers superior low dielectric loss characteristics, enabling clean signal integrity across the full RF spectrum—from sub-GHz applications to 200 GHz and beyond. At the core of every SiP is our precision through glass via (TGV) technology— 50-micron diameter I/Os with metal redistribution line/spacing below 30 microns. Combined with in-glass integrated passive devices (IPD) such as inductors, capacitors, and integrated matching elements, the result is a compact, high-performance package without the electrical compromises of organic substrates.

Key Benefits

• Heterogeneous integration (HI), enabling the packaging of digital IC, analog IC, RF IC, and MEMS into a common package

• Reduce chip size by 70% compared to PCBs

• Up to 20% reduction in power utility

• More than a 50% increase in wireless bandwidth

• Wideband applications ranging from DC to 100 GHz

• Embed passive devices (e.g. inductors, capacitors, baluns, antennas, etc.) into the package

• Lower cost of ownership by minimizing assembly costs

• Reduce time to market