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Pure Play Glass Foundry & Manufacturing Services
As a U.S.-based glass packaging foundry, 3DGS provides end-to-end manufacturing services supporting advanced packaging programs from early design for manufacturability through qualified production. Our secure facility focuses on glass-based integration for RF, photonics, AI/HPC, and defense applications, offering flexible process flows, scalable form factors, and optimized cost-performance solutions tailored to customer requirements.
Wafer Processing
3DGS operates a specialized glass semiconductor foundry using APEX glass, high-performance fused silica (HPFS), and ceramic glass wafers compatible with standard semiconductor wafer fabrication equipment. The platform supports applications across wireless communications, aerospace & defense, photonics, High Performance Compute (HPC), and sensor systems. Our patented manufacturing process integrates seamlessly with established fabrication techniques, enabling rapid prototyping to production transitions.
Panel Processing
3DGS is expanding its manufacturing capability to include large-format panel processing. The planned 510 mm × 515 mm panel line is intended to improve manufacturing efficiency and enable scalable production for advanced packaging applications.
Engineering Services
3DGS provides turnkey glass packaging solutions from collaborative design through assembly. We have extensive design rules and PDK support to help our customers plan and optimize their design for a first-pass fab success. We also offer flexible assembly options through in-house prototyping and trusted OSAT partners.