For 2.5D and 3D IC packaging, TGVs are a critical technology for enabling continued device miniaturization, improved performance and lower-cost processing. 3DGS has perfected the technique, with scalable manufacturing for repeatable high quality.

3DGS’ patented APEX® glass is unlike other glass substrates in that processing transforms patterned areas of the substrate to become ceramic, while others remain glass. Etching of the ceramic areas creates 3D microstructures while maintaining the integrity of the glass area. The process allows a low-cost, high-volume, wafer-level production solution ideal for miniaturized, high performance electronic devices.