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RF Substrates
Interposers and substrates that enable high performance SiP and AiP applications are critical in the age of high density, high integration advanced electronic systems. Glass-based technology from 3DGS offers a lower-cost, low-loss alternative to challenging and expensive silicon techniques.
RF SiP
Compact footprint SiPs using glass enables next-generation RF and wireless designs to facilitate wideband applications from DC to 100 GHz.
AiP
3DGS’ patented air cavity manufacturing process allows 5G millimeter-wave (mmWave) antenna and transmission-line-based structures with superior performance as compared to conventional packaging technologies, which are plagued with path losses and signal degradation. 3DGS AiP devices are scalable up to 200 GHz.