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Co-Packaged Optics (CPO) Enabled by Glass Substrates

Co-Packaged Optics (CPO) is redefining data center and high-performance computing architectures by integrating optical and electronic components into a single package for higher bandwidth, lower latency, and improved energy efficiency. Glass substrate for co-packaged optics (CPO) plays a critical role in this evolution, acting as a high-performance interposer that combines optical and electrical functionality into one scalable platform.

Key Capabilities of 3DGS Glass Substrates

Embedded optical waveguides for low-loss signal routing

Multi-layer electrical redistribution layers (RDLs) for high-density interconnects

Through-glass vias (TGVs) enabling vertical 3D integration

Seamless integration with ASICs and photonic integrated circuits (PICs)

Support for full optical signal chain (modulation to fiber coupling)

Advanced Material and Integration Advantages

With built-in passive LC components and superior material properties, 3DGS glass substrates enable compact, high-performance photonic systems.

Embedded capacitors, inductors, and resistors to reduce parasitics

High modulus and tunable CTE for mechanical and thermal stability

Optical transparency for efficient photonic integration

Precision cavities for heterogeneous chip integration

Compatibility with flip-chip, thermocompression, and SMT assembly

Driving Scalable CPO Solutions

These capabilities position 3DGS as a key enabler of scalable CPO solutions for AI infrastructure, hyperscale data centers, and next-generation photonic packaging.