3D Heterogeneous Integration (3DHI) System-in-Package 

Overview of 3D Heterogeneous Integration (3DHI)

3D Heterogeneous Integration (3DHI) enables true system-in-package (SiP)architectures by vertically stacking multiple glass substrate layers in the Z-direction. This advanced approach allows seamless integration of diverse semiconductor technologies, including GaAs, GaN, CMOS, Si, SiGe, and passive components, within a single compact package. 

By combining RF, compute, power, and cooling elements into one structure, 3DHI delivers highly integrated, high-performance systems optimized for advanced applications such as high-performance computing, RF systems, and next-generation electronics. 

Key Advantages and Capabilities of 3DHI

True 3D Integration for High-Density Design

• Stack multiple layers of glass substrate for compact, high-density system design 

Significant SWaP-C Reduction

• > 90% reduction in size 

• > 90% reduction in weight 

• > 20% lower power consumption 

Multi-Technology Integration

• Supports heterogeneous materials and chiplets in a single SiP 

• Enables integration of GaAs, GaN, CMOS, Si, and SiGe technologies 

Flexible Assembly Compatibility

• Compatible with wire bonding, flip chip, and SMT processes 

• Simplifies manufacturing and integration workflows 

RF Shielded System-in-Package

• Improved signal integrity for high-frequency and RF applications 

• Reduces interference and enhances performance 

Direct PCB Integration

• Supports BGA or LGA attachment for simplified system assembly 

• Enables faster deployment and system-level integration 

Applications of 3DHI System-in-Package

This architecture is ideal for: 

• High-performance computing (HPC) systems 

• Advanced RF and microwave applications 

• Aerospace and defense electronics 

• Next-generation communication systems