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3D Heterogeneous Integration (3DHI) System-in-Package 

3D Heterogeneous Integration (3DHI) enables true 3D system-in-package (SiP) architectures by vertically stacking multiple glass substrate layers in the Z-direction. 

 This approach allows seamless integration of diverse semiconductor technologies, including GaAs, GaN, CMOS, Si, SiGe, and passive components, within a single compact package. By combining RF, compute, power, and cooling elements into one structure, 3DHI delivers highly integrated, high-performance systems optimized for advanced applications. 

 

Key Advantages and Capabilities 

  • True 3D Integration: Stack multiple layers of glass substrate for compact, high-density system design 

  • Significant SWaP-C Reduction: 

  • > 90% reduction in size 

  • > 90% reduction in weight 

  • > 20% lower power consumption 

  • Multi-Technology Integration: Supports heterogeneous materials and chiplets in a single SiP 

  • Assembly Flexibility: Compatible with wire bonding, flip chip, and SMT processes 

  • RF Shielded SiP: Improved signal integrity for high-frequency applications 

  • Direct PCB Integration: Supports BGA or LGA attachment for simplified system assembly 

 

This architecture is ideal for high-performance computing, RF systems, and advanced electronics where integration density, efficiency, and system-level performance are critical.