Thermal

Thermal performance is enhanced through the use of unique structure designs leveraging 100% copper pillars for minimized stress and improved thermal cycling performance over the long-term. Package size can be significantly reduced and thermal transfer significantly improved as compared to other approaches.

A modern, open, copper-colored architectural model with a grid of vertical rods on one side and a smooth, sloped surface on the other.
Orange geometric abstract shape on a light background.

thermal Management

3DGS thermal designs constructed of high-efficiency copper allow scalability and flexibility with compact designs that offer thermal transfer of up to 100 W/m-K.

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