• Glass 3D Heterogeneous Integration

    3D Glass Solutions (3DGS) provides glass three-dimensional heterogeneous integration (3DHI) foundry services to commercial and defense manufacturers, academia and government agencies.

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  • 3DGS Offers High performance Fused Silica (HPFS) Glass solutions

    HPFS with its extremely low loss coefficient enables Automotive Radar substrates in 70 - 150 GHz frequency range and high frequency filters in 10 - 100 GHz frequency range

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Wireless Communications

3DGS enables high performance RF subsystem implementation with significant SWaP-C benefits up to 500 GHz. Applications ranging from simple filters and high gain antennas up to complete RF Front ends

Aerospace & Defense

3-Dimensional Heterogeneous Integration (3DHI), High Temp and RAD HARD features offered by 3DGS along with secure on-shore processing facility benefits space and Defense Industrial Base (DIB) customers in USA

Photonics

Thermal stability and isolation enables lasers and Photonic Integrated Circuits (PIC) to be efficiently packaged together on Glass substrate. 3DGS photonics platform along with 3DHI offers unique value proposition for photonic subsystems

HPC/AI

Glass supports large substrate size, high interconnect density, fine redistribution line and spacing for Chiplet integration to support rapidly growing AI market

Sensors

Glass offers unique features ideally suited for bio-sensors and quantum dot sensors