Wireless Communications
3DGS enables high performance RF subsystem implementation with significant SWaP-C benefits up to 500 GHz. Applications ranging from simple filters and high gain antennas up to complete RF Front ends
Aerospace & Defense
3-Dimensional Heterogeneous Integration (3DHI), High Temp and RAD HARD features offered by 3DGS along with secure on-shore processing facility benefits space and Defense Industrial Base (DIB) customers in USA
Photonics
Thermal stability and isolation enables lasers and Photonic Integrated Circuits (PIC) to be efficiently packaged together on Glass substrate. 3DGS photonics platform along with 3DHI offers unique value proposition for photonic subsystems
HPC/AI
Glass supports large substrate size, high interconnect density, fine redistribution line and spacing for Chiplet integration to support rapidly growing AI market
Sensors
Glass offers unique features ideally suited for bio-sensors and quantum dot sensors