Thermal
Thermal solutions include thermal vias with excellent thermal transfer capabilities of over 100 W/m-K. Thermal features can also be used as fully integrated shielding and grounding solutions for interposers and substrates.
Thermal solutions include thermal vias with excellent thermal transfer capabilities of over 100 W/m-K. Thermal features can also be used as fully integrated shielding and grounding solutions for interposers and substrates.
3DGS thermal designs constructed of high-efficiency copper allow scalability and flexibility with compact designs that offer thermal transfer of up to 100 W/m-K.
Read More