Interposers and Substrates
Glass-based interposers for SiP and AiP as well as photonic modules are made possible by 3DGS-enabled integration of semiconductor devices, SMT components and IPDs directly onto interposers.
RF SiP (System in Package)
Compact footprint SiPs using glass enables next-generation RF and wireless designs to facilitate wideband applications from DC to 100 GHz.
AiP
3DGS’ patented air cavity manufacturing process allows 5G millimeter-wave (mmWave) antenna and transmission-line-based structures with superior performance as compared to conventional packaging technologies, which are plagued with path losses and signal degradation. 3DGS AiP devices are scalable up to 200 GHz.