Integrated Passive Devices (IPD)

3DGS technology allows RF designs to create high performance IPDs. With 3DGS techniques, integration of 3D inductors, MIM capacitors, thin film resistors, resonator cavities and integrated in-part shielding are possible. 3D-designed IPDs eliminate parasitic crossovers and are very low loss.

28 GHz Bandpass Filters
3DGS offers custom design and fabrication of mmWave filters to meet the most stringent performance needs.
IPD Matching Networks
3DGS IPD-ready components improve impedance matching networks with high-efficiency energy transfer and reduced losses. Significantly improve Power Amplifier efficiency performance compared to planar silicon or glass IPDs.
LC Resonators
3DGS LC resonators integrate High Q 3D inductors (Q>90) and capacitors (Q>200) as a single device for oscillators and timing circuits. Ultra-thin, these devices are easily incorporated into PLL IC packages and MCMs.
Lumped Element RF Microwave Filters
Overall performance of SIP devices is significantly improved using 3DGS RF/Microwave high Q, low insertion loss filters as compared to alternative approaches using silicon or other glasses.
RF Integrated Passive Devices IPD
Integrated Passive Devices (IPDs) from 3DGS eliminate parasitic crossover and are very low loss. Integration of 3D inductors, MIM capacitors, thin film resistors, resonator cavities and integrated in-part shielding are possible.