Improve Performance and Reduce Footprint

Precisely match impedance values with reduced footprints and heights.

CUSTOM RF BRIDGES

RF bridges are incorporated to improve circuit-to-circuit electrical connections by utilizing an impedance-matched RF bridge chip with uniform wire bond lengths. These RF bridges are custom designed to meet customer-specific bridging requirements for chip integration and height.

GROUNDED CO-PLANAR WAVEGUIDE DESIGN

3DGS RF bridges utilize low-loss glass substrates with TGVs which allow RF waveguides to have grounding along both sides and below the transmission line for highest performance.

Top wire pads are compatible with wire bonding.

HIGHLY SCALABLE

Lithographic reproduction processes facilitate mass production of devices with superior batch-to-batch consistency.

Specifications

Parameters Typical Performance
Impedance values 25 Ω to 100 Ω
Thickness 90 μm to 800 μm
Attenuation (dB) As low as 0.3 dB/cm at 30 GHz
Size As small as 0.5 mm x 0.5 mm
Operating Temperature SMT -55°C to +155°C
Compliance RoHS

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CONTACT US

To learn more about how 3DGS can build your advanced antenna products, please contact us.