Improve Performance and Reduce Footprint
Precisely match impedance values with reduced footprints and heights.
CUSTOM RF BRIDGES
RF bridges are incorporated to improve circuit-to-circuit electrical connections by utilizing an impedance-matched RF bridge chip with uniform wire bond lengths. These RF bridges are custom designed to meet customer-specific bridging requirements for chip integration and height.
GROUNDED CO-PLANAR WAVEGUIDE DESIGN
3DGS RF bridges utilize low-loss glass substrates with TGVs which allow RF waveguides to have grounding along both sides and below the transmission line for highest performance.
Top wire pads are compatible with wire bonding.
Lithographic reproduction processes facilitate mass production of devices with superior batch-to-batch consistency.
|Impedance values||25 Ω to 100 Ω|
|Thickness||90 μm to 800 μm|
|Attenuation (dB)||As low as 0.3 dB/cm at 30 GHz|
|Size||As small as 0.5 mm x 0.5 mm|
|Operating Temperature||SMT -55°C to +155°C|