IMPROVE PERFORMANCE AND REDUCE PACKAGE SIZE
High density arrays simplify integration, alignment, and assembly. High accuracy alignments reduce assembly errors and improve assembly costs.
Wafer-level production ensures high-volume production with run-to-run repeatability.
3D Glass Solutions’ manufacturing process ensures the accurate manufacturing of edge wraps and alignment features with micro-scale precision every time!
ELECTRICAL AND OPTICAL INTEGRATION
Electrical traces can be combined with thru-holes or edge wraps to maximize integration possibilities further reducing package sizes.
CUSTOM SOLUTIONS FOR IMPROVED OUTCOMES
Each application is unique in footprint, thermal management requirements, and additional features. Contact us directly with your specific needs.
|Size||0.75mm x 0.75mm||0.25mm x 0.35mm|
|Angular tolerances||70 - 110° (+/- 1.5°)||70 - 110° (+/- 1.0°)|
|Pad width||100 - 500 microns||75 - 500 microns|
|Spacing between pads||100 microns||75 microns|
|Thermal capacity||1 W / mK||50 W / mK|
|Assembly options||Solder, Wire bond||Solder, Wire bond|